Multilayer capacitor

ABSTRACT

A first inner conductor, a second inner conductor, a first inner conductor, and a second inner conductor are disposed in the order mentioned from the top in the dielectric element. The first inner conductors are respectively led out to two opposing side surfaces of the dielectric element. A pair of the second inner conductors is respectively led out to two opposing side surfaces different from the two opposing side surfaces to which the first inner conductors are respectively led out. Terminal electrodes are respectively disposed on four side surfaces of the dielectric element for connection with these four inner conductors respectively.

This is a Division of application Ser. No. 10/527,023 filed Mar. 8,2005, which in turn is a National Stage Application of InternationalApplication No. PCT/JP03/011490 filed Sep. 9, 2003. The disclosure ofthe prior applications is incorporated by reference herein in itsentirety.

TECHNICAL FIELD

The present invention relates to a multilayer capacitor wherein theequivalent serial inductance (ESL) is substantially reduced, moreparticularly, one suitable for a multilayer ceramic capacitor used for adecoupling capacitor.

BACKGROUND ART

Recently, CPU (central processing unit) used for information processingdevice, along with an improvement of a processing speed and a highintegration, operating frequencies has become high and consumptiveelectricity has become remarkably increased. Together with above, theoperating voltages tend to decrease as the consumptive electricitydecreases.

Accordingly, power source supplying electricity to CPU develops higherand larger current fluctuations. Therefore, it became extremelydifficult to suppress the voltage fluctuation due to the currentfluctuation within the permissible level of the power source.

Therefore, as shown in FIG. 18, multilayer capacitor 100 calleddecoupling capacitor connected to the power source 102 is beingfrequently used for a power source stabilizing measures. And when at atransitional change of the power source due to its high speed, by quickcharge and discharge of electricity, electric current is supplied to CPU104 from this multilayer capacitor 100 to suppress the voltagefluctuation of power source 102.

However, along with a tendency to become higher frequency of theoperating frequencies at CPU of today, the current fluctuations becomehigher and larger. And that the equivalent serial inductance (ESL) ofmultilayer capacitor 100 as shown in FIG. 18 is becoming to greatlyinfluence the voltage fluctuation of power source.

In other words, at conventional multilayer capacitor 100 used for powersupply circuit of CPU 104 as shown in FIG. 18 indicates high ESL, aparasitic component of equivalent circuit as shown in FIG. 18,therefore, together with electric current fluctuations I as shown inFIG. 19, the ESL will obstruct the charge and discharge of electricityof multilayer capacitor 100. Accordingly, same with above, voltagefluctuations V of power source tend to become large as shown in FIG. 19,and are increasingly becoming unable to sufficiently handle the higherspeed of CPU in the future.

This is because the voltage fluctuations at a transmittal time ofelectric current when at charge and discharge of electricity closelyresemble the following equation 1 and unevenness of the ESL is relatedto the size of voltage fluctuations.dV=ESL·di/dt   equation 1

Here, dV is voltage fluctuation (V) at transmittal time, I is fluctuantamount of electric current (A), and t is fluctuant time (second).

Conventional multilayer capacitor as shown in FIG. 21 has a structure ofthe following. Pairs of ceramic layers 112A respectively including 2kinds of internal conductors 114 and 116 as shown in FIG. 22 arealternately laminated to be dielectric body 112. The 2 kinds of internalconductors 114 and 116 respectively led out toward two facing sidesurfaces 112B, 112C of dielectric body 112 and respectively connected toterminal electrodes 118, 120 arranged at the outer part of dielectricbody 112.

DISCLOSURE OF THE INVENTION

Considering the above factors of the invention, an object of the presentinvention is to provide a multilayer capacitor wherein ESL issubstantially decreased.

In order to achieve the above object, multilayer capacitor according tothe first object of the invention is, a multilayer capacitor wherein aplural number of internal conductors are respectively disposed betweendielectric sheets in dielectric body formed by laminating a pluralnumber of dielectric sheets, wherein the internal conductors comprising;

-   at least a pair of first internal conductors respectively led out    toward two facing side surfaces of dielectric sheets, and-   at least a pair of second internal conductors respectively led out    toward two facing side surfaces of the dielectric sheets different    from the two facing side surfaces where said first internal    conductors are led out, wherein-   the second internal conductor is arranged between a pair of the    first internal conductors intervening said dielectric sheets, and-   the first internal conductor is arranged between a pair of the    second internal conductors intervening said dielectric sheets.

Multilayer capacitor according to the first object of the inventioncomprises a plural number of internal conductors disposed betweendielectric sheets in dielectric body formed by laminating a pluralnumber of dielectric sheets. Moreover, a pair of the first internalconductors is respectively led out toward two facing side surfaces ofdielectric body and a pair of the second internal conductors isrespectively led out toward two facing side surfaces of the dielectricbody different from the two facing side surfaces where said firstinternal conductors are led out.

Namely, the abovementioned plural number of internal conductors arecomprising pairs of the first internal conductors and the pairs of thesecond internal conductors. And in between pairs of the first internalconductors and pairs of the second internal conductors, there exists oneinternal conductor between pairs of the other internal conductors.

For instance, pairs of the first internal conductors become mutuallyhomopolar by disposing a second internal conductor in between, and thepairs of the first internal conductor are respectively led out towardtwo facing side surfaces of the dielectric body. Therefore, in the pairsof the first internal conductors, electric currents start to passmutually in the opposite direction. On the other, in the pairs of thesecond internal conductors, electric currents start to pass mutually inthe opposite direction.

Accordingly, it brings about an action to cancel the magnetic field notonly by electric currents passing in the opposite direction between thepairs of the first internal conductors, but by the electric currentspassing in the opposite direction between the pairs of the secondinternal conductors. Together with an occurrence of action to cancel themagnetic field, parasitic inductances of multilayer capacitor can bereduced and effect to reduce the equivalent serial inductance begins.

In these circumstances, according to the multilayer capacitor of thefirst object of the invention, the multilayer capacitor is attempted fora substantial reduce of ESL and that as an attenuation amount at a highfrequency range increases, the voltage fluctuations of power sourcebecome possible to be suppressed. Namely, multilayer capacitor accordingto the first object of the invention is preferably used as a decouplingcapacitor in CPU power supply circuit.

Preferably, multilayer capacitor according to the first object of theinvention having

-   at least a pair of first terminal electrodes arranged at two facing    side surfaces of the dielectric body and respectively connected to a    pair of the first internal conductors, and-   a pair of second terminal electrodes arranged at two facing side    surfaces of the dielectric body, different from the two facing side    surfaces wherein said first internal conductors are arranged, and    respectively connected to a pair of the second internal conductors.

In this case, mutually facing pairs of the first terminal electrodes areconnected to the outer portion of the multilayer capacitor wherein apair of the first terminal electrodes are mutually homopolar. Mutuallyfacing pairs of the second terminal electrodes are also connected to theouter portion of the multilayer capacitor wherein a pair of the secondterminal electrodes is mutually homopolar. Consequently, as pairs of thefirst internal conductors become mutually homopolar, pairs of the secondinternal conductors become mutually homopolar. Therefore, acts of themultilayer capacitor as in the first object of the invention may furtherbe affected without fail.

Preferably, at least one of said first internal conductor and saidsecond internal conductor comprises a plural number of segmentedconductors alternately led out toward two facing side surfaces of thedielectric body segmented in the way that the conductors extend inparallel form.

Namely, electric currents flow in the opposite direction in a pluralpairs of segmented conductors that are a pair of the first internalconductors respectively segmented. Further, electric currents flow inthe opposite direction in a plural pairs of segmented conductors thatare a pair of the second internal conductors respectively segmented. Asa result, not only bringing about an action to cancel the magnetic fieldbetween internal conductors arranged in the laminated direction, but bythe flow of electric currents in the opposite directions in adjoiningsegmented conductors extending mutually in a line in a plain, it alsobring about an action to cancel the magnetic field.

As a result, together with an occurrence of action to cancel themagnetic field between these segmented conductors, parasitic inductancesof multilayer capacitor can further be reduced and effect to reduce theequivalent serial inductance further begins.

Preferably, mutually adjoining said segmented conductors arranged in aplane are respectively connected to said terminal electrode respectivelyarranged two facing side surfaces. Accordingly, directions of theelectric currents flowing respectively in adjoining conductors becomeopposite.

Preferably, lead parts respectively connected to the first terminalelectrode and the second terminal electrode are formed in the firstinternal conductor and the second internal conductor. The width of leadpart may be the same, smaller, or larger with the width of the firstinternal conductor and/or the second internal conductor.

Preferably, a lead part connected to the terminal electrode is formed insegmented conductor. At least 3 segmented conductors are arranged in aplane. Then, 2 of the 3 segmented conductors arranged in every othersegmented conductor are connected through said lead part. By theabovementioned composition, the flow of electric currents in theadjoining segmented conductors in a plane become opposite.

Preferably, width of the lead parts arranged in a plane facing eachother are nearly the same. By making width of the lead parts nearly thesame, connection with the terminal electrode can be done without fail.

Preferably, a planar shape of the segmented conductor is notparticularly limited and may be rectangle, triangle, trapezoid or anyother form, however, to obtain larger capacitance with the limited size,it is preferably rectangle triangle, or trapezoid.

Multilayer capacitor according to the second object of the invention is,a multilayer capacitor wherein a plural number of internal conductorsare respectively disposed between dielectric sheets in dielectric bodyformed by laminating a plural number of dielectric sheets, characterizedin that

-   the internal conductors comprising-   at least a pair of first internal conductors respectively led out    toward two facing side surfaces of dielectric sheets, and-   at least a pair of second internal conductors respectively led out    toward two facing side surfaces of the dielectric sheets different    from the two facing side surfaces where said first internal    conductors are led out, wherein-   the second internal conductor is arranged between a pair of the    first internal conductors intervening said dielectric sheets,-   the first internal conductor is arranged between a pair of the    second internal conductors intervening said dielectric sheets,-   the first internal conductor comprises a plural number of segmented    conductors wherein the conductors are segmented to extend mutually    in a row and are alternately led out toward two facing side surfaces    of dielectric body, and-   the first internal conductors mutually adjoining in the laminated    direction disposing the second internal conductor in between are    arranged to superpose upon each other when observed from planner    view, the segmented conductors that superpose upon each other are    alternately led out toward the opposite directions.

Multilayer capacitor according to the second object of the invention iseffective in below mentioned actions in addition to the actions of themultilayer capacitor according to the first object of the invention.Namely, two segmented conductors of the adjoining first internalconductor in the laminated direction disposing the second internalconductor in between become mutually homopolar and moreover, flows ofelectric currents become different direction. Further, electric currentsstart to flow in the opposite direction in mutually adjoining segmentedconductors in a plane.

Accordingly, electric currents flow in the opposite direction insegmented conductors in the first internal conductor arranged in thelaminated direction. Electric currents also flow in the oppositedirection in a pair of the second internal conductor. Therefore,abovementioned electric currents respectively bring about an action tocancel the magnetic field. Further, electric currents start to flow inthe opposite direction in mutually adjoining segmented conductors in aplane and that it bring about an action to cancel the magnetic field.

As a result, together with an occurrence of action to cancel themagnetic field between these conductors, parasitic inductances ofmultilayer capacitor can be reduced and effect to reduce the equivalentserial inductance begins.

According to the second object of the invention, the second internalconductor, may be segmented as in the first internal conductor, or notsegmented.

Multilayer capacitor according to the second object of the inventionhaving;

-   a plural pairs of the first terminal electrodes respectively    connected to a plural number of segmented conductors and are    respectively led out toward two facing side surfaces of the    dielectric body,-   a pair of the second terminal electrodes respectively connected to a    pair of the second internal conductor and respectively led out    toward two facing side surfaces of dielectric body different from    two facing side surfaces where plural pairs of the first terminal    electrodes are led out.

By forming these terminal electrodes on the side surfaces of dielectricbody, together with the segmented conductors composing the firstinternal conductor become homopolar without fail, a pair of the secondinternal conductor mutually become homopolar without fail.

According to the first and the second objects of the invention, concreteshape of the dielectric body is not particularly limited but preferablyin a shape of rectangular parallelepiped. Namely, dielectric sheets arerespectively shaped in a quadrilateral form such as rectangle and bylaminating the dielectric sheets, dielectric body is shaped inrectangular parallelepiped form.

According to the first and the second objects of the invention,preferably, plural pairs of the first and the second internal conductorsare arranged in the laminated direction respectively in said dielectricbody. In this case, not only capacitance of multilayer capacitorincreases, effect to cancel the magnetic field further increases andthat inductances substantially decreases and ESL further decreases.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be described in detail from the descriptionof the preferred embodiments given with reference to the attacheddrawings, wherein;

FIG. 1 is a broken down perspective view of multilayer capacitoraccording to the first embodiment of the invention;

FIG. 2 is a perspective view of multilayer capacitor shown in FIG. 1;

FIG. 3 is a sectional view of FIG. 2 taken along the line III-III;

FIG. 4 is an equivalent circuit diagram of multilayer capacitor shown inFIG. 1;

FIG. 5 is a broken down perspective view of multilayer capacitoraccording to the other embodiment of the invention;

FIG. 6 is a sectional view of multilayer capacitor shown in FIG. 5;

FIG. 7 is a broken down perspective view of multilayer capacitoraccording to the other, embodiment of the invention;

FIG. 8 is a broken down perspective view of multilayer capacitoraccording to the other embodiment of the invention;

FIG. 9 is a broken down perspective view of multilayer capacitoraccording to the other embodiment of the invention;

FIG. 10 is a broken down perspective view of multilayer capacitoraccording to the other embodiment of the invention;

FIG. 11A is a circuit diagram showing a state of capacitor as incomparative example of the invention connected to network analyzer;

FIG. 11B is a circuit diagram showing a state of capacitor as in exampleof the invention connected to network analyzer;

FIG. 12 is a graph of attenuation characteristics showing capacitor ofexample and comparative example of the invention;

FIG. 13 is a broken down perspective view of multilayer capacitoraccording to the other embodiment of the invention;

FIG. 14 is a perspective view of multilayer capacitor shown in FIG. 13;

FIG. 15 is a sectional view of FIG. 14 taken along the line XV-XV;

FIG. 16 is a circuit diagram showing example of using multilayercapacitor shown in FIG. 13 to 15;

FIG. 17 is a graph showing attenuation characteristics of capacitor ofexample and comparative example of the invention;

FIG. 18 is a circuit diagram using conventional example of multilayercapacitor;

FIG. 19 is a graph showing relations between current fluctuations andvoltage fluctuations in circuit shown in FIG. 18;

FIG. 20 is an equivalent circuit diagram of multilayer capacitor as inconventional example;

FIG. 21 is a perspective view of multilayer capacitor as in conventionalexample;

FIG. 22 is a broken down perspective view showing part of internalconductor of multilayer capacitor as in conventional example.

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment

Multilayer ceramic capacitor (only mentioned “Multilayer capacitor” fromhere) 10 according to the present embodiment is shown in FIG. 1 to 4. Asshown in these figures, the multilayer capacitor 10 comprises a mainportion of dielectric body 12 which is a rectangular parallelepipedsintered body obtained by firing multilayer body wherein a plural numberof ceramic green sheet of dielectric sheets are laminated. In thedielectric body 12, the first internal conductor 21, the second internalconductor 23, the first internal conductor 22 and the second internalconductor 24 each forming approximate square (may be rectangle) arearranged from the top in the order, and between each pairs of internalconductors, ceramic layers 12A are respectively arranged.

In the present embodiment, ceramic layers 12A that are dielectric sheetsafter firing are respectively disposed between each internal conductors,and in the dielectric body 12, 4 kinds of internal conductors 21, 23,22, and 24 are arranged in the order. Underneath the internal conductor24, as shown in FIG. 3, in the same way as mentioned above, these 4kinds of internal conductors 21, 23, 22, and 24 are repeatedlylaminated. In example as shown in FIG. 3, two sets in total are arrangedin the dielectric body 12 wherein a set comprises 4 kinds of internalconductors 21, 23, 22, and 24.

As the materials of these internal conductors 21 to 24, not only basemetal materials such as Nickel, Nickel alloy, copper, or copper alloycan be used but materials comprising said metals as main component mayalso be considered.

As shown in FIG. 1 to 3, at the left side part of the first internalconductor 21, a lead part 21A led out toward left side surface 12B(shown in FIG. 2) of dielectric body 12 is formed. The internalconductor 21 is extended from the side surface 12B, where the lead partis led out, toward the facing side surface 12D (shown in FIG. 2) andwill not be led out toward the side surfaces 12C, 12D, or 12E except forthe side surface 12B. A plane form of the first internal conductor 21except for a lead part 21A is a square or parallelepiped form slightlysmaller than the plane form of ceramic layer 12A. In this embodiment,width of the lead part 21A is smaller than that of the first internalconductor 21.

On front side of the second internal conductor 23 arranged throughceramic layer 12A underneath the first internal conductor 21, a leadpart 23A led out toward front side 12C (shown in FIG. 2) of dielectricbody 12 is formed. This internal conductor 23 is extended from the ledout side surface 12C toward the facing side surface 12E (shown in FIG.2) and not led out by side surfaces 12B, 12D, or 12E but the sidesurface 12C. A plane form of the second internal conductor 23 except fora lead part 23A is a square or parallelepiped form slightly smaller thanthe plane form of ceramic layer 12A. In this embodiment, width of thelead part 23A is smaller than that of the second internal conductor 23.

On right side of the first internal conductor 22 arranged throughceramic layer 12A underneath the second internal conductor 23, a leadpart 22A led out toward right side 12D (shown in FIG. 2) of dielectricbody 12 is formed. This internal conductor 22 is extended from the ledout side surface 12D toward the facing side surface 12B (shown in FIG.2) and not led out by side surfaces 12B, 12C, or 12E but the sidesurface 12D. A plane form of the first internal conductor 22 except fora lead part 22A is a square or parallelepiped form slightly smaller thanthe plane form of ceramic layer 12A. In this embodiment, width of thelead part 22A is smaller than that of the first internal conductor 22.

On back side of the second internal conductor 24 arranged throughceramic layer 12A underneath the first internal conductor 22, a leadpart 24A led out toward back side 12E (shown in FIG. 2) of dielectricbody 12 is formed. This internal conductor 24 is extended from the ledout side surface 12E toward the facing side surface 12C (shown in FIG.2) and not led out by side surfaces 12B, 12C, or 12D but the sidesurface 12E. A plane form of the second internal conductor 24 except fora lead part 24A is a square or parallelepiped form slightly smaller thanthe plane form of ceramic layer 12A. In this embodiment, width of thelead part 24A is smaller than that of the first internal conductor 22.

Namely, as shown in FIG. 1 and 3, the second internal conductor 23 isarranged between a pair of the first internal conductors 21 and 22,then, the first internal conductor 22 is arranged between a pair of thesecond internal conductors 23 and 24. And underneath the internalconductor 24, same with above, 4 kinds of internal conductors 21, 23, 22and 24 as shown in FIG. 3, are arranged in the order.

According to the present embodiment, the first internal conductors 21and 22 are respectively led out toward two facing side surfaces 12B and12D of dielectric body 12. The second internal conductors 23 and 24 arerespectively led out toward two facing side surfaces 12C and 12Edifferent from the two side surfaces 12B and 12D where the firstinternal conductors 21 and 22 are led out. Namely, branch portions 21A,23A, 22A and 24A of these 4 kinds of internal conductors 21, 23, 22 and24 are respectively arranged at 4 side surfaces of dielectric body 12 inorder not to lie on each other when reflected in the laminated directionshown by arrow Z as in FIG. 1 and FIG. 2.

In order to connect branch portion 21A of internal conductor 21, thefirst terminal electrode 31 as shown in FIG. 2 and FIG. 3 is connectedto outer part of dielectric body 12 at side surface 12B of dielectricbody 12. Further, in order to connect to lead part 22A of internalconductor 22, the first terminal electrode 32 is provided at the outerpart of dielectric body 12 at side surface 12D of dielectric body 12.

Further, in order to connect to branch portion 23A of internal conductor23, the second terminal electrode 33 is provided at the outer part ofdielectric body 12 at side surface 12C of dielectric body 12. In orderto connect to branch portion 24A of internal conductor 24, the secondterminal electrode 34 is provided at the outer part of dielectric body12 at side surface 12E of dielectric body 12.

Namely, in the present embodiment, a pair of the first internalelectrodes 31 and 32 are respectively arranged at two facing sidesurfaces 12B and 12D of dielectric body 12. Further, a pair of thesecond terminal electrodes 33 and 34 is respectively arranged at twofacing side surfaces 12C and 12E that are different from the two facingside surfaces 12B and 12D where terminal electrodes 31 and 32 arearranged.

In the present embodiment, internal conductors 21 to 24 composesmutually facing electrodes of capacitor and terminal electrodes 31 to 34connected to these internal conductors 21 to 24 at side surfaces 12B to12E of multilayer capacitor are arranged to compose equivalent circuitas shown in FIG. 4. Accordingly, multilayer capacitor 10 of the presentembodiment has a composition where terminal electrodes 31 to 34 arerespectively arranged at all 4 side surfaces 12B to 12E of dielectricbody 12 in the shape of hexahedron form of a rectangular parallelepiped.

Next, actions of multilayer capacitor 10 of the present embodiment isdescribed.

According to multilayer capacitor 10 of the present embodiment, a pluralnumber of internal conductors are respectively arranged in the form ofbeing disposed between ceramic layers 12A in dielectric body 12 in shapeof a rectangular parallelepiped form wherein a plural number ofdielectric sheets respectively becoming said ceramic layer 12A arelaminated.

Further, a pair of internal conductors 21 and 22 are respectively ledout from the two facing side surfaces 12B and 12D of dielectric body 12and a pair of the internal conductors 23 and 24 are respectively led outtoward two facing side surfaces 12C and 12E different from the twofacing side surfaces 12B and 12D where a pair of internal conductors 21and 22 are led out.

Namely, the above-mentioned plural number of internal conductors arecomprising a pair of internal conductors 21, 22 and a pair of internalconductors 23, 24. In the present embodiment, the second internalconductor 23 is arranged between the first internal conductors 21 and 22and the first internal conductor 22 is arranged between the secondinternal conductors 23 and 24.

Further, in the present embodiment, a pair of the first terminalelectrodes 31 and 32 respectively arranged at two facing side surfaces12B and 12D of dielectric body 12 are respectively connected to theabovementioned a pair of the first internal conductors 21 and 22.Further, a pair of the second terminal electrodes 33 and 34 respectivelyarranged at two facing side surfaces 12C and 12E, different from theside surfaces 12B and 12D where the first terminal electrodes 31 and 32are arranged, are respectively arranged at the abovementioned pair ofthe second internal conductors 23 and 24.

Namely, a pair of internal conductors 21 and 22 are respectively led outtoward two facing side surfaces 12B and 12D of dielectric body 12 andrespectively connected to a pair of mutually facing terminal electrodes31 and 32. Moreover, as mentioned above, the second internal conductor23 is disposed between these first internal conductors 21 and 22. Inorder to function as capacitor, a pair of terminal electrodes 31 and 32is connected to wiring or so at outer part of multilayer capacitor 10 inorder that the electrodes have mutually homopolar characteristic. As aresult, in this pair of internal conductors 21 and 22, as shown in FIG.1 with arrows, electric currents pass in opposite direction and a pairof the first internal conductors 21 and 22 becomes mutually homopolar.

On the other, at a pair of the second internal conductors 23 and 24, apair of mutually facing second terminal electrodes 33 and 34 isconnected to wiring or so at outer part of multilayer capacitor 10 inorder that the electrodes have mutually homopolar characteristic.Accordingly, in this pair of the second internal conductors 23 and 24,as shown in FIG. 1 with an arrow, by the same reason, electric currentspass in opposite directions and a pair of internal conductors 23 and 24becomes mutually homopolar.

Accordingly, by electric currents flow in the opposite direction in apair of internal conductors 21 and 22, not only bringing about an actionto cancel the magnetic field, but by electric flows in the oppositedirection in a pair of internal conductors 23 and 24, it brings about anaction to cancel the magnetic field. And with the action to cancel themagnetic field between these internal conductors, parasitic inductancesof multilayer capacitor 10 can be reduced then, it will be effective toreduce equivalent serial inductance (ESL).

Considering above, multilayer capacitor 10 according to the presentembodiment, it is preferably used as decoupling capacitor andsubstantial reduce of ESL of multilayer capacitor 10 can be achieved.And according to multilayer capacitor 10 of the present embodiment,together with an improvement in an attenuation amount at a highfrequency range, it becomes possible to suppress the voltagefluctuations of power supply and is preferably used in CPU power supplycircuit.

Further, by arranging a plural pairs of the first internal conductors 21and 22 and the second internal conductors 23 and 24, not onlycapacitance of multilayer capacitor 10 according to the presentembodiment increases but also an action to cancel magnetic field furtherincreases and inductance are substantially reduced and ESL is furtherreduced.

Manufacturing method of multilayer capacitor 10 according to the presentembodiment, by laminating dielectric sheets that are in quadrilateralform such as rectangular parallelepiped, dielectric body 12 can beformed in rectangular parallelepiped form. As a result, in the presentembodiment, lead parts of internal conductors 21 to 24 is formed at allside surfaces 12B to 12E of dielectric body 12 in shape of rectangularparallelepiped form that the capacitor of the embodiment uses itsability to the full to reduce ESL.

The Second Embodiment

Next, the second embodiment of multilayer capacitor according to thepresent embodiment is described based on FIG. 5 and FIG. 6. Further,parts common with the parts explained in the first embodiment areassigned the same reference numerals and overlapping explanations areomitted.

According to the above first embodiment, each internal conductors areformed independently in the same plane. On the other, consideringinternal conductors of the present embodiment, as shown in FIG. 5 andFIG. 6, internal conductors arranged in the same plane are segmented inthe way that the conductors extend in the parallel form. The firstinternal conductor 21 laminated on the top as shown in FIG. 5 comprisesa plural number (2 in the present embodiment) of segmented conductors 41and 42 that are alternately led out by two facing side surfaces 12B and12D (shown in FIG. 2) of dielectric body 12.

The first internal conductor 22 making a pair with the first internalconductor 21 are segmented in the way that they extend in the parallelform, and the first internal conductor 22 comprises a plural number (2in the present embodiment) of segmented conductors 43 and 44 alternatelyled out toward two facing side surfaces 12B and 12D of dielectric body12. The segmented conductors 43 and 44 superpose upon said segmentedconductors 41 and 42 when observed from planner view, though a segmentedconductor and a segmented conductor that superpose upon said segmentedconductor are led out in the opposite direction toward two facing sidesurfaces 12B and 12D.

Namely, mutually facing segmented conductors 41 and 43 in the laminateddirection (planner view direction) are led out respectively toward twomutually facing side surfaces 12B and 12D. In the same way, mutuallyfacing segmented conductors 42 and 44 in the laminated direction are ledout respectively toward two facing side surfaces 12D and 12B. In thepresent embodiment, the segmented conductor 41 and the segmentedconductor 44 are respectively connected to terminal electrode 31 asshown in FIG. 2 and the segmented conductor 42 and the segmentedconductor 43 are respectively connected to terminal electrode 32 asshown in FIG. 2.

According to the present embodiment, the second internal conductor 23 isalso segmented in the way that the segmented conductors mutually extendin the parallel form and it comprises a plural number (2 in the presentembodiment) of segmented conductors 45 and 46 alternately led out towardtwo facing side surfaces 12C and 12E (as shown in FIG. 2) of dielectricbody 12. The second internal conductor 24 is also segmented in the waythat the segmented conductors mutually extend in the parallel form andit comprises a plural number (2 in the present embodiment) of segmentedconductors 47 and 48 alternately led out toward two facing side surfaces12C and 12E of dielectric body 12. The segmented conductors 45 and 46superpose upon the segmented conductors 47 and 48 when observed fromplanner view, though a segmented conductor and a segmented conductorthat superpose upon said segmented conductor are led out in the oppositedirection toward two facing side surfaces 12C and 12E.

Namely, mutually facing segmented conductors 45 and 47 are respectivelyled out toward two facing side surfaces 12C and 12E. And mutually facingsegmented conductors 46 and 48 are respectively led out toward twofacing side surfaces 12E and 12C. In the present embodiment, segmentedconductor 45 and segmented conductor 48 are respectively connected toterminal electrode 33 as shown in FIG. 2 and segmented conductor 46 andsegmented conductor 47 are respectively connected to terminal electrode34 as shown in FIG. 2.

Accordingly, electric currents flow in the opposite direction insegmented conductors 41 and 42 and in segmented conductors 43 and 44shown by arrows in FIG. 5 and electric currents flow in the oppositedirection in segmented conductors 45 and 46 and between segmentedconductors 47 and 48 shown by arrows in FIG. 5. Accordingly, not onlybringing about an action to cancel the magnetic field, but electricflows in the opposite direction in the same plane in segmentedconductors 41 and 42, between segmented conductors 43 and 44, betweensegmented conductors 45 and 46, and between segmented conductors 47 and48 respectively extended in the parallel forms, respectively bring aboutan action to cancel the magnetic field.

As a result, with an action to cancel magnetic field between eachinternal conductors, parasitic inductances of multilayer capacitor 10can substantially be reduced then, it becomes effective to reduceequivalent serial inductance (ESL).

The Third Embodiment

Next, the third embodiment of multilayer capacitor according to thepresent embodiment is described based on FIG. 7. Further, parts commonwith the parts explained in the first embodiment are assigned the samereference numerals and overlapping explanations are omitted.

In the present embodiment, as shown in FIG. 7, the first internalconductor 21 comprises a plural number (3 in the present embodiment) ofsegmented conductors 51, 52 and 53 that are alternately led out towardtwo facing side surfaces 12B and 12D (shown in FIG. 2) of dielectricbody 12.

Further, the first internal conductor 22 comprises a plural number (3 inthe present embodiment) of segmented conductors 54, 55 and 56 that areled out toward two facing side surfaces 12B and 12D of dielectric body12. These segmented conductors 54, 55 and 56 superpose upon thesegmented conductors 51, 52 and 53 when observed from planner view,though the segmented conductors and segmented conductors that lie uponsaid segmented conductors are led out in the opposite direction towardtwo facing side surfaces 12B and 12D.

Namely, mutually facing segmented conductors 51 and 54 in the laminateddirection are led out respectively toward two facing side surfaces 12Band 12D. In the same way, mutually facing segmented conductors 52 and 55in the laminated direction are led out respectively toward two facingside surfaces 12D and 12B. In the same way, mutually facing segmentedconductors 53 and 56 in the laminated direction are led out respectivelytoward two facing side surfaces 12B and 12D.

In the present embodiment, the segmented conductors 51, 53 and 55 arerespectively connected to terminal electrode 31 as shown in FIG. 2 andthe segmented conductor 52, 54 and 56 are respectively connected toterminal electrode 32 as shown in FIG. 2.

The second internal conductor 23 is segmented in the way that thesegmented conductors mutually extend in the parallel form and comprisesa plural number (3 in the present embodiment) of segmented conductors57, 58 and 59 led out toward two facing side surfaces 12C and 12E (asshown in FIG. 2) of dielectric body 12. The second internal conductor 24is also segmented in the way that the segmented conductors mutuallyextend in the parallel form and it comprises a plural number (3 in thepresent embodiment) of segmented conductors 60, 61 and 62 led out towardtwo facing side surfaces 12C and 12E of dielectric body 12. Thesegmented conductors 60, 61 and 62 superpose upon the segmentedconductors 57, 58 and 59 when observed from planner view, though thesegmented conductors and the segmented conductors that superpose uponsaid segmented conductor are led out in the opposite direction towardtwo facing side surfaces 12C and 12E.

Namely, mutually facing segmented conductors 57 and 60 are respectivelyled out toward two facing side surfaces 12C and 12E. In the same way,mutually facing segmented conductors 58 and 61 are respectively led outtoward two facing side surfaces 12E and 12C. In the same way, mutuallyfacing segmented conductors 59 and 62 are respectively led out towardtwo facing side surfaces 12C and 12E.

In the present embodiment, segmented conductors 58, 60 and 62 arerespectively connected to terminal electrode 33 as shown in FIG. 2 andsegmented conductors 57, 59 and 61 are respectively connected toterminal electrode 34 as shown in FIG. 2.

Accordingly, electric currents flow in the opposite direction insegmented conductors 51, 52 and 53 and in segmented conductors 54, 55and 56 shown by arrows in FIG. 7. Electric currents flow in the oppositedirection in segmented conductors 57, 58 and 59 and in segmentedconductors 60, 61 and 62 shown by arrows in FIG. 7. As a result, notonly bringing about an action to cancel the magnetic field respectively,but electric flows in the opposite direction in the same plane insegmented conductors 51, 52 and 53, in segmented conductors 54, 55 and56, in segmented conductors 57, 58 and 59, and in segmented conductors60, 61 and 62 respectively extended in the parallel forms, respectivelybring about an action to cancel the magnetic field.

As a result, same with above second embodiment, parasitic inductances ofmultilayer capacitor 10 can substantially be reduced then, it becomeseffective to reduce equivalent serial inductance.

The Fourth Embodiment

Next, the fourth embodiment of multilayer capacitor according to thepresent invention is described based on FIG. 8. Further, parts commonwith the parts explained in the first embodiment are assigned the samereference numerals and overlapping explanations are omitted.

In the present embodiment, as shown in FIG. 8, the first internalconductor 21 comprises a plural number of segmented conductors 71 and 72that are alternately led out toward two facing side surfaces 12B and 12D(shown in FIG. 2) of dielectric body 12. Provided that in the presentembodiment, the segmented conductor 71 is connected to a lead part 71Aand nearly U-shaped as a whole. Further, the segmented conductor 72 isunited with a lead part 72A having the same width with the lead part 71Aand nearly T-shaped as a whole. Then, point part of the segmentedconductor 72 should go in between a pair of segmented conductors 71.

The first internal conductor 22 making a pair with the first internalconductor 21 is segmented in the way that they extend in the parallelform, and the first internal conductor 22 comprises a plural number ofsegmented conductors 73 and 74 alternately led out toward two facingside surfaces 12B and 12D of dielectric body 12. The segmentedconductors 73 and 74 superpose upon the segmented conductors 71 and 72when observed from planner view, though segmented conductors andsegmented conductors that superpose upon said segmented conductors areled out in the opposite direction toward two facing side surfaces 12Band 12D.

The segmented conductor 73 is connected to a lead part 73A and nearlyU-shaped as a whole. Further, the segmented conductor 74 is united witha lead part 74A having the same width with the lead part 73A and nearlyT-shaped as a whole. Then, point part of the segmented conductor 74should go in between a pair of segmented conductors 73.

Further, the second internal conductor 23, arranged between the firstinternal conductors 21 and 22, comprises a plural number of segmentedconductors 75 and 76 that are alternately led out toward two facing sidesurfaces 12C and 12E (shown in FIG. 2). Provided that in the presentembodiment, the segmented conductor 75 is connected to a lead part 75Aand nearly U-shaped as a whole. Further, the segmented conductor 76 isunited with a lead part 76A having the same width with the lead part 75Aand nearly T-shaped as a whole. Then, point part of the segmentedconductor 76 should go in between a pair of segmented conductors 75.

The second internal conductor 24 making a pair with the second internalconductor 23 is segmented in the way that they extend in the parallelform, and The second internal conductor 24 comprises a plural number ofsegmented conductors 77 and 78 alternately led out toward two facingside surfaces 12C and 12E of dielectric body 12. The segmentedconductors 77 and 78 superpose upon the segmented conductors 75 and 76observed from planner view, though segmented conductors and segmentedconductors that superpose upon said segmented conductors are led out inthe opposite direction toward two facing side surfaces 12C and 12E.

The segmented conductor 77 is connected to a lead part 77A and nearlyU-shaped as a whole. Further, the segmented conductor 78 is united witha lead part 78A having the same width with the lead part 77A and nearlyT-shaped as a whole. Then, point part of the segmented conductor 78should go in between a pair of segmented conductors 77.

The segmented conductors 71 and 74 are connected to terminal electrode31, the segmented conductors 72 and 73 are connected to terminalelectrode 32, the segmented conductors 75 and 78 are connected toterminal electrode 33, the segmented conductors 76 and 77 are connectedto terminal electrode 34, and each terminal electrode 71 to 78, samewith the second embodiment, is connected to each terminal electrodes 31to 34 as shown in FIG. 2 respectively.

Accordingly, electric currents flow in the opposite direction in facingsegmented conductors 71 and 73 in the laminated direction shown byarrows in FIG. 8. Electric currents also flow in the opposite directionin segmented conductors 72 and 74. Electric currents flow in theopposite direction in facing segmented conductors 75 and 77 in thelaminated direction shown by arrows in FIG. 8. Further, electriccurrents flow in the opposite direction in segmented conductors 76 and78. Accordingly, abovementioned flows of electric currents bring aboutan action to cancel the magnetic field.

Further, in the way that the T-shaped segmented conductor 72 goes inbetween U-shaped segmented conductor 71, even adjoining segmentedconductors 71 and 72 mutually extended in the same plane, by electricflow in the opposite direction, respectively bring about an action tocancel the magnetic field. Further, in the same way, between segmentedconductors 73 and 74, between segmented conductors 75 and 76, andbetween segmented conductors 77 and 78 respectively bring about anaction to cancel the magnetic field by electric flow in the oppositedirection.

As a result, same with above second embodiment, parasitic inductances ofmultilayer capacitor 10 can substantially be reduced then, it becomeseffective to reduce equivalent serial inductance.

The Fifth Embodiment

Next, the fifth embodiment of multilayer capacitor according to thepresent invention is described based on FIG. 9 of the fifth embodiment.Further, parts common with the parts explained in the first embodimentare assigned the same reference numerals and overlapping explanationsare omitted.

In the present embodiment, as shown in FIG. 9, the first internalconductor 21 comprises a plural number (2 in the present embodiment) ofsegmented conductors 81 and 82 that are alternately led out by twofacing side surfaces 12B and 12D (shown in FIG. 2) of dielectric body12. Provided that, in the present embodiment, these segmented conductors81 and 82 are respectively forming nearly a triangle.

Further, the first internal conductor 22 making a pair with the firstinternal conductor 21 are segmented in the way that they extend in theparallel form, and a plural number (2 in the present embodiment) ofsegmented conductors 83 and 84 are alternately led out toward two facingside surfaces 12B and 12D of dielectric body 12. In the presentembodiment, these segmented conductors 83 and 84 are respectivelyforming nearly a triangle. These segmented conductors 83 and 84 arearranged to superpose respectively upon the segmented conductors 81 and82 when observed from planner view at a position symmetric with respectto a point. The segmented conductors that are symmetric with respect toa point are led out in the opposite direction toward two facing sidesurfaces 12B and 12D.

The second internal conductor 23 arranged between the first internalconductors 21 and 22 are segmented in the way that they extend in theparallel form, and a plural number (2 in the present embodiment) ofsegmented conductors 85 and 86 are alternately led out toward two facingside surfaces 12C and 12E(as shown in FIG. 2) of dielectric body 12.Provided that, in the present embodiment, these segmented conductors 85and 86 are respectively forming nearly a triangle.

Further, the second internal conductor 24 making a pair with the secondinternal conductor 23 are segmented in the way that they extend in theparallel form, and a plural number (2 in the present embodiment) ofsegmented conductors 87 and 88 are alternately led out toward two facingside surfaces 12C and 12E of dielectric body 12. In the presentembodiment, these segmented conductors 87 and 88 are respectivelyforming nearly a triangle. These segmented conductors 87 and 88 arearranged to superpose respectively upon the segmented conductors 85 and86 when observed from planner view at a position symmetric with respectto a point. The segmented conductors that are symmetric with respect toa point are led out in the opposite direction toward two facing sidesurfaces 12C and 12E.

The segmented conductors 81 and 84 are connected to terminal electrode31, the segmented conductors 82 and 83 are connected to terminalelectrode 32, the segmented conductors 85 and 88 are connected toterminal electrode 33, the segmented conductors 86 and 87 are connectedto terminal electrode 34. Namely, each terminal electrode 81 to 88, samewith the second embodiment, is respectively connected to each terminalelectrodes 31 to 34 shown in FIG. 2.

Accordingly, electric currents flow in the opposite direction in facingsegmented conductors 81 and 83 in the laminated direction shown byarrows in FIG. 9. Electric currents flow in the opposite direction insegmented conductors 82 and 84. Electric currents flow in the oppositedirection in facing segmented conductors 85 and 87 in the laminateddirection shown by arrows in FIG. 9. In the same way, electric currentsflow in the opposite direction in segmented conductors 86 and 88.Accordingly, abovementioned flows of electric currents bring about anaction to cancel the magnetic field.

Further, electric flows in the opposite direction in the same plane insegmented conductors 81 and 82, in segmented conductors 83 and 84, insegmented conductors 85 and 86, and in segmented conductors 87 and 88respectively extended in the parallel forms, respectively bring about anaction to cancel the magnetic field.

As a result, in the present embodiment, in the same way as the secondembodiment, with an action to cancel magnetic field between eachinternal conductors, parasitic inductances of multilayer capacitor 10can substantially be reduced then, it becomes effective to reduceequivalent serial inductance(ESL).

The Sixth Embodiment

Next, multilayer capacitor of sixth embodiment according to the presentinvention is described based on FIG. 10. Further, parts common with theparts explained in the first embodiment are assigned the same referencenumerals and overlapping explanations are omitted.

In the present embodiment, as shown in FIG. 10, a pair of the firstinternal conductors 21 and 22 comprises internal conductors 91 and 92manufactured in nearly the same way with the first embodiment. Further,a pair of the second internal conductors 23 and 24, in the same way asthe third embodiment, respectively comprises 3 segmented conductors 57,58 and 59 and 3 segmented conductors 60, 61 and 62.

In the present embodiment, internal conductor 91 is connected toterminal electrode 31 and internal conductor 92 is connected to terminalelectrode 32. Further, segmented conductors 58, 60 and 62 arerespectively connected to terminal electrode 33 and segmented conductors57, 59 and 61 are respectively connected to terminal electrode 34.

Accordingly, electric currents flow in the opposite direction in facinginternal conductors 91 and 92 in the laminated direction shown by arrowsin FIG. 10. Electric currents flow in the opposite direction between insegmented conductors 57, 58 and 59 and in segmented conductors 60, 61and 62. Accordingly, abovementioned flows of electric currentsrespectively bring about an action to cancel the magnetic field.Further, flows of electric currents among segmented conductors 57, 58and 59 and among segmented conductors 60, 61 and 62, extended inparallel form in a plane, respectively bring about an action to cancelthe magnetic field.

As a result, even with the present embodiment, same with the secondembodiment, parasitic inductances of multilayer capacitor 20 cansubstantially be reduced then, it becomes effective to reduce equivalentserial inductance(ESL).

EXAMPLE 1

Next, with network analyzer, S21 characteristic of S parameter of eachsample below were measured and attenuation characteristics of eachsample were respectively found. First, content of each sample aredescribed. Namely, generally used capacitor of multilayer capacitorhaving two terminal electrodes as shown in FIG. 21 and 22 are madecomparative example 1 and multilayer capacitor having four terminalelectrodes according to the second embodiment as shown in FIG. 5 andFIG. 6 are made example 1. Then, capacitor of the comparative example 1is connected to Port 1 and Port 2 of network analyzer as shown in FIG.11A and further, in the same way, capacitor of example 1 is connected tothe same as shown in FIG. 11B and respectively measured.

Here, a constant of equivalent circuit, wherein a measured value of theattenuation characteristic and attenuation amount of the equivalentcircuit as shown in FIG. 20 are the same, were measured. From the dataof the attenuation characteristics of each sample shown in FIG. 12, itcan be noticed that the attenuation amount of Example 1 at a highfrequency range of at least 20 MHz is increasing in the amount ofapproximately 15 dB compared to comparative example 1. From the data, animprovement of high frequency characteristics in examples can be seen.

On the other, calculated ESL shown in table 1 is substantially reducedin Example 1 compared to the same in comparative example 1. Therefore,it was confirmed that table 1 also proves the effect of the invention.TABLE 1 C (μF) ESR (mΩ) ESL (pH) Comp. Ex. 1 1.038 6.3 825.2 Ex. 1 0.9543.3 102.3In the table 1, C is electrostatic capacities and ESL is equivalentserial resistance. The size of each sample used here is, as shown inFIGS. 21 and 2, when the distance between side surfaces of dielectricbody where a pair of internal conductors are led out is L and thedistance between side surfaces that lie at right angles with the sidesurfaces of dielectric body where a pair of internal conductors are ledout is W, the sizes of each samples used are as following. Incomparative example 1, L=2.0 mm and W=1.25 mm and in example 1, L=1.6 mmand W=1.6 mm.

Further, multilayer capacitor 10 according to the above embodiment isconsidered to have two sets, each set having 4 layers, and 8 layers inall. However, the number of layers is not limited to this and it canfurther be increased. For instance, the number of layers may be severaldecades or several hundreds. After the second embodiment of theabove-mentioned embodiment, structures each having 2 or 3 segmentedconductors are arranged is shown, though each may have 4 segmentedconductors.

The Seventh Embodiment

Multilayer ceramic capacitor (only mentioned “Multilayer capacitor” fromhere) 210 according to the present embodiment is shown in FIG. 13 to 15.As shown in these figures, the multilayer capacitor 210 comprises a mainportion of dielectric body 212 which is a rectangular parallelepipedsintered body obtained by firing multilayer body wherein a plural numberof ceramic green sheet of dielectric sheets are laminated.

In the dielectric body 212, the first internal conductors 21, the secondinternal conductors 23, the first internal conductors 22 and the secondinternal conductors 24 are arranged. Between each layer, ceramic layers212A are respectively arranged. The first internal conductor 21comprises segmented conductors 221, 222 and 223 and the first internalconductor 22 making a pair with said first internal conductor 21,comprises segmented conductors 224, 225 and 226. The second internalconductors 23 and 24 respectively comprise only one internal conductor227 and 228.

Namely, in the present embodiment, having ceramic layers 212A asdielectric sheets after firing are disposed in between, segmentedconductors 221 to 223, an internal conductor 227, segmented conductors224 to 226 and an internal conductor 228 are respectively arranged indielectric body 12 in the order. Further, underneath the internalconductor 228, as shown in FIG. 15, in the same order as mentionedabove, these 4 layers of electrodes are repeated and two sets in totalare arranged where a set comprises said 4 layers of electrodes. As thematerials of segmented conductors 21 to 26 each forming approximaterectangle and internal conductors 27 and 28 each forming approximatesquare, not only base metal materials such as Nickel, Nickel alloy,copper, or copper alloy can be used but materials comprising said metalsas main component may also be used.

Further, as shown in FIG. 13 to 15, at back side of the segmentedconductors 221 and 223, lead parts 221A and 223A where side surface 212B(shown in FIG. 14) of back side of dielectric body 212 are respectivelyformed. The segmented conductors 221 and 223 are respectively extendedfrom the side face 212B toward the facing side surface 212D (as shown inFIG. 2).

At the front side of segmented conductor 222 arranged between thesesegmented conductors 221 and 223, a lead part 222A drawn toward the sidesurface 212D of front side of dielectric body 212 is formed. Thesegmented conductor 222 is extended from the drawn side surface 212Dtoward the facing side surface 212B.

Namely, these plural number (3 in the present embodiment) of segmentedconductors 221, 222 and 223 are segmented in the way that the conductorsare mutually lined up and extended in the same plane and are alternatelyled out toward the two facing side surfaces 212B and 212D.

Underneath these segmented side surfaces 221 to 223, an internalconductor 227 is arranged and at the left side portion of this internalconductor 227, a branch portion 227A led out from the left side surface212C (shown in FIG. 14) of dielectric body 212 is formed. Internalconductor 227 is extended from the led out side surface 212C toward thefacing side surface 212E(shown in FIG. 2).

Underneath this internal conductor 227, a plural number (3 in thepresent embodiment) of segmented conductors 224, 225 and 226 arearranged. At the front side of said segmented conductors 224 and 226, abranch portion 224 A and 226A led out from the side surface 212D offront side of dielectric body 212 are respectively formed. Thesesegmented conductors 224 and 226 are respectively extended from the sidesurface 212D toward the facing side surface 212B.

At back side of the segmented conductor 225 arranged between thesesegmented conductors 224 and 226, a branch portion 225A led out towardside surface 212B of back side of dielectric body 212. This segmentedconductor 225 is extended from the side surface 212B toward the facingside surface 212D.

Namely, these plural number (3 in the present embodiment) of segmentedconductors 224, 225 and 226 are segmented in the way that the conductorsare extending mutually in a line in a plain and are alternately led outtoward the two facing side surfaces 212D and 212B. Further, thesegmented conductors 224, 225, and 226 respectively superpose upon thesegmented conductors 221, 222, and 223 when observed from planner view.A segmented conductor and a segmented conductor that superpose upon saidsegmented conductor are led out in the opposite direction.

Underneath these segmented conductors 224 to 226, an internal conductor228 is arranged and at right side of this internal conductor 228, abranch portion 228A led out from the right side surface 212E ofdielectric body 212 is formed. Internal conductor 228 is extended fromthe side surface 212E toward the facing side surface 12C.

Considering above, segmented conductors 221 and 224 led out toward thetwo facing side surfaces 12B and 12D, although internal conductor 227 isdisposed in between, are arranged mutually in the laminated direction(the direction shown by an arrow Z). In the same way as above, ansegmented conductor 222 and the segmented conductor 225 are, althoughinternal conductor 227 is disposed in between, mutually facing in thelaminated direction. And in the same way, the segmented conductor 223and the segmented-conductor 226 are, although internal conductor 227 isdisposed in between, mutually facing in the laminated direction.Further, segmented conductors 224, 225 and 226, and the segmentedconductors 221, 222 and 223 shown in FIG. 15 arranged underneath saidsegmented conductors 224, 225 and 226 have the same relation asmentioned above.

And a pair of internal conductors 227 and 228 are respectively led outtoward the two facing side surfaces 212C and 212E, different from thetwo facing side surfaces 212B and 212D where said 6 segmented conductors221 to 226 are led out.

As shown in FIG. 14, as to connect to lead parts 221A, 222A and 223A ofeach segmented conductors 221, 222 and 223, a plural number (3 in thepresent embodiment) of terminal electrodes 231, 232 and 233 isalternately arranged to the outer part of dielectric body 212 at theside surfaces 212B and 212D of dielectric body 212.

Further, in order to connect to lead parts 224A, 225A and 226A of eachsegmented conductors 224, 225 and 226, a plural number (3 in the presentembodiment) of terminal electrodes 234, 235 and 236 are alternatelyarranged to the outer part of dielectric body 12 at side surfaces 212Dand 212B of dielectric body 212.

Further, in order to connect to lead parts 227A of internal conductor227, terminal electrode 237 is arranged to the outer part of dielectricbody 212 at the side surface 212C of dielectric body 212. Further, inorder to connect to lead parts 228A of internal conductor 228, terminalelectrode 238 is arranged to the outer part of dielectric body 12 at theside surface 212E of dielectric body 212.

Namely, as shown in FIG. 14, these terminal electrodes 231, 232, and 233and terminal electrodes 234, 235, and 236 are respectively arranged tothe two facing side surfaces 212B and 212D of dielectric body 212.Further, terminal electrodes 237 and 238 are respectively arranged attwo facing side surfaces 212C and 212E different from the two facingside surfaces 212B and 212D where terminal electrodes 231 to 236 arearranged. Capacitor according to the present embodiment is array typemultilayer capacitor.

According to the present embodiment, considering FIGS. 13 and 15,internal conductor 227 is arranged between segmented conductors 221 to223 and segmented conductors 224 to 226. And segmented conductors 224 to226 are arranged between internal conductor 227 and internal conductor228. Namely, mutually facing electrodes of capacitor are formed betweensegmented conductors 221 to 223 and internal conductor 227, internalconductor 227 and segmented conductors 224 to 226, and segmentedconductor 224 to 226 and internal conductor 228, and consequentlydeveloping capacitor functions.

And, in the present embodiment, terminal electrodes 231 to 236 arrangedat two side surfaces 212B and 212D respectively connected at segmentedconductors 221 to 226 composes pairs of the first terminal electrodes.Terminal electrodes 237 and 238 arranged at two side surfaces 212C and212E respectively connected at internal conductors 227 and 228 composepairs of the second terminal electrodes. Multilayer capacitor 210according to the present embodiment comprises terminal electrodes 231 to236 and terminal electrodes 237 and 238 respectively arranged at allfour side surfaces 212B to 212E of dielectric body 212 in shape of ahexahedron form of rectangular parallelepiped.

Next, multilayer capacitor 210 according to the present embodiment isdescribed. In order to function as capacitor, 3 pairs of terminalelectrodes 231 to 236 is connected to wiring or so at the outer part ofmultilayer capacitor 210 in order that the electrodes have mutuallyhomopolar characteristic. In these segmented conductors 221 to 223 andsegmented conductors 224 to 226, as shown in FIG. 13 with arrows,electric currents pass in opposite direction and 3 segmented conductors221 to 223 and segmented conductors 224 to 226 become mutuallyhomopolar.

A pair of facing terminal electrodes 237 and 238 are connected to wiringor so at outer part of multilayer capacitor 210 in the way that theterminal electrodes are mutually homopolar. In a pair of internalelectrodes 227 and 228, with the same reason, shown with arrows as inFIG. 1, electric currents flow in the opposite direction and a pair ofinternal conductors 227 and 228 becomes mutually homopolar.

Further, electric currents start to flow in the opposite direction inadjoining segmented conductors 221 to 223. By the same reason, electriccurrents start to flow in the opposite directions in adjoining segmentedconductors 224 to 226 in the way that the electric currents in saidconductors 224 to 226 are respectively opposite to the electric currentsin corresponding conductors 221 to 223.

Accordingly, electric currents flow in the opposite direction between in3 segmented conductors 221 to 223 and in 3 segmented conductors 224 to226. Further, electric currents flow in the opposite direction in a pairof internal conductors 227 and 228. Accordingly, in the laminateddirection, not only bringing about an action to cancel the magneticfield, but by electric flows in the opposite direction in the sameplane, it brings about an action to cancel the magnetic field.

Then, with an action to cancel magnetic field between these conductors,parasitic inductances of multilayer capacitor 210 can be reduced then,it becomes effective to reduce equivalent serial inductance (ESL).

According to above, multilayer capacitor 210 of the present embodiment,it is preferably used as decoupling capacitor and substantial reduce ofESL of multilayer capacitor 210 can be achieved. And according tomultilayer capacitor 210 of the present embodiment, together with animprovement in an attenuation amount at a high frequency range, itbecomes possible to suppress the voltage fluctuations of power supplyand is preferably used in CPU power supply circuit.

According to FIG. 15, a plural set of 3 segmented conductors 221 to 223,3 segmented conductors 224 to 226, and a pair of internal conductors 227and 228 is respectively arranged in dielectric body 12 to increasecapacitance of multilayer capacitor 210 of the present embodiment. Withmultilayer capacitor 210 of the present embodiment, an action to cancelmagnetic field further increases and inductance are substantiallyreduced and ESL is further reduced.

On the occasion of manufacturing multilayer capacitor 210 of the presentembodiment, by laminating dielectric sheets that are in quadrilateralform such as rectangular parallelepiped, dielectric body 212 can beformed in rectangular parallelepiped form. As a result, multilayercapacitor 210 of the present embodiment comprises lead parts ofconductors that are provided on all side surfaces 12 B to 12E ofdielectric body 12 in shape of rectangular parallelepiped form having 4side surfaces 12B to 12E that are in optimum form from the stand pointof manufacturing method. Accordingly, multilayer capacitor 210 uses itsability to the full to reduce ESL.

Next, examples of using multilayer capacitor 210 according to thepresent embodiment is described based on FIG. 16.

In this example, 3 sets of power sources 241, 242 and 243 and 3 sets ofIC 251, 252 and 253 such as CPU are respectively made pairs and mutuallyconnected. Namely, power source 241 and IC 251 are connected, powersource 242 and IC 252 are connected, and power source 243 and IC 253 areconnected.

Next, terminal electrode 231 connected to segmented conductor 221 ofmultilayer capacitor 210 and terminal electrode 234 connected tosegmented conductor 224 are respectively connected between power source241 and IC 251. Further, terminal electrode 232 connected to segmentedconductor 222 and terminal electrode 235 connected to segmentedconductor 225 are respectively connected between power source 242 and IC252. Further, terminal electrode 233 connected to segmented conductor223 and terminal electrode 236 connected to segmented conductor 226 arerespectively connected between power source 243 and IC 253. On theother, terminal electrode 237 connected to internal electrode 227 andterminal electrode 238 connected to internal conductor 228 arerespectively grounded.

Considering above, with this example, for instance, terminal electrodes231 to 236 are made mutually homopolar wherein it is plus and terminalelectrodes 237 to 238 are made mutually homopolar and are minas,substantial decreasing of ESL is attempted and that voltage fluctuationof power sources 241, 242 and 243 can be suppressed.

EXAMPLE 2

Next, by using network analyzer, S21 characteristic of S parameter ofeach sample below was measured and attenuation characteristics of eachsample was respectively found. First, content of each sample will bedescribed. Namely, multilayer capacitor comprising two terminals shownin FIG. 21, which is a general capacitor, is made comparative example 1,and multilayer capacitor comprising many terminals as in the embodimentshown in FIG. 14 is made example 2.

Here, a constant of equivalent circuit, wherein a measured value of theattenuation characteristic and attenuation amount of the equivalentcircuit are the same, were measured. From the data of the attenuationcharacteristics of each sample shown in FIG. 17, it can be noticed thatthe attenuation amount of Example 2 at a high frequency range of atleast 20 MHz is increasing in the amount of approximately 15 dB comparedto the same in comparative example 1. From the data, an improvement ofhigh frequency characteristics in example 2 can be seen.

On the other, calculated ESL shown in table 2 is substantially reducedin Example 2 compared to the same in comparative example 1. Therefore,it was confirmed that table 2 also proves the effect of the invention.TABLE 2 C (μF) ESR (mΩ) ESL (pH) Comp. Ex. 1 1.038 6.3 825.2 Ex. 2 1.0622.8 143.4In the table 2, C is electrostatic capacities and ESL is equivalentserial resistance. The size of each sample used here is, as shown inFIGS. 21 and 14, when the distance between side surfaces of dielectricbody where a pair of internal conductors are led out is L and thedistance between side surfaces that lie at right angles with the sidesurfaces of dielectric body where a pair of internal conductors are ledout is W, the sizes of each samples used are as following. Incomparative example 1, L=2.0 mm and W=1.25 mm and in example 2, L=1.6 mmand W=1.6 mm.

Further, multilayer capacitor 210 according to the above embodiment isconsidered to have two sets, each set having 4 layers, and 8 layers inall. However, the number of layers is not limited to this and it canfurther be increased. For instance, the number of layers may be severaldecades or several hundreds. According to the above-mentionedembodiment, structures wherein 3 segmented conductors are arranged in aplane are shown, though each may have 2 or 4 segmented conductors. Thepresent invention is not limited to the above-mentioned embodiment andit may alternately change in different ways within the scope of theinvention.

1. A multilayer capacitor wherein a plural number of internal conductorsare respectively disposed between dielectric sheets in dielectric bodyformed by laminating a plural number of dielectric sheets, the internalconductors comprising: at least a pair of first internal conductorsrespectively led out toward two facing side surfaces of dielectricsheets, and at least a pair of second internal conductors respectivelyled out toward two facing side surfaces of the dielectric sheetsdifferent from the two facing side surfaces where said first internalconductors are led out, wherein at least one of the pair of the secondinternal conductors is arranged between a pair of the first internalconductors intervening said dielectric sheets, at least one of the pairof the first internal conductors is arranged between a pair of thesecond internal conductors intervening said dielectric sheets, at leasta pair of first terminal electrodes arranged at two facing side surfacesof the dielectric body and respectively connected to a pair of the firstinternal conductors, and a pair of second terminal electrodes arrangedat two facing side surfaces of the dielectric body, different from thetwo facing side surfaces where said first internal conductors arearranged, and respectively connected to a pair of the second internalconductors, at least one of the first internal conductor and the secondinternal conductor comprises two segmented conductors alternately ledout toward two facing side surfaces of the dielectric body segmented inthe way that the conductors extend in parallel form, and mutuallyadjoining segmented conductors arranged in the same plane arerespectively connected to the terminal electrodes respectively arrangedat two facing side surfaces.
 2. The multilayer capacitor as set forth inclaim 1, wherein lead parts respectively connected to the first terminalelectrode and the second terminal electrode are formed in the firstinternal conductor and the second internal conductor.
 3. The multilayercapacitor as set forth in claim 1, wherein width of the lead partsarranged in a plane facing each other are substantially the same.
 4. Themultilayer capacitor as set forth in claim 1, wherein a planar shape ofthe segmented conductor is rectangle, triangle, or trapezoid.
 5. Amultilayer capacitor wherein a plural number of internal conductors arerespectively disposed between dielectric sheets in dielectric bodyformed by laminating a plural number of dielectric sheets, the internalconductors comprising: at least a pair of first internal conductorsrespectively led out toward two facing side surfaces of dielectricsheets, and at least a pair of second internal conductors respectivelyled out toward two facing side surfaces of the dielectric sheetsdifferent from the two facing side surfaces where said first internalconductors are led out, wherein at least one of the pair of the secondinternal conductors is arranged between a pair of the first internalconductors intervening said dielectric sheets, at least one of the pairof the first internal conductors is arranged between a pair of thesecond internal conductors intervening said dielectric sheets, the atleast one of the pair of the first internal conductors comprises twosegmented conductors wherein the conductors are segmented to extendmutually in a row and are alternately let out toward two facing sidesurfaces of dielectric body, the at least one of the pair of the firstinternal conductors mutually adjoining in the laminated directiondisposing the second internal conductor in between are arranged tosuperpose upon each other when observed from planar view, the segmentedconductors that superpose upon each other when observed from planar vieware alternately led out toward the opposite directions, and mutuallyadjoining segmented conductors arranged in the same plane arerespectively connected to the terminal electrodes respectively arrangedat two facing side surfaces.
 6. The multilayer capacitor as set forth inclaim 5, wherein the second internal conductors are not segmented. 7.The multilayer capacitor as set forth in claim 1, wherein the dielectricbody is in a shape of rectangular parallelepiped.
 8. The multilayercapacitor as set forth in claim 1, wherein plural pairs of the first andthe second internal conductors are arranged in the laminated directionrespectively in the dielectric body.